Objective

Completing a job task within timely manner,  to adhere to all procedures and becoming familiar with all dept. safety procedures & regulations via online computer terminal.

Experience

1998–1999                    Microelectronics                      East Fishkill, NY

Supplemental Manufacturing Process Operator.

§     TCM Substrate Ion Beam Process.

§     Inspection of TCM Substrates after completion of process.

§     Training operators in TCM Substrate Ion Beam operation.

1983–1993                    IBM, DSD Mfg., Division        Poughkeepsie, NY

Data Systems Packaging Division.

§     Alcorn TCM Substrate Chip Placement operation.

§     Excimer laser Ablation & Inspection.

TCM Substrate Wire Prep - IDAB Substrate Wire Prep – Pre-Reflow TCM Substrate Inspection and Chip Inspection, further duties included training on all process operations.

Education

1971–1975                    Beacon High                                  Beacon, NY

§     High School Educated

Awards

Quality team suggestion award to assure that the identification and control of Nodules & Plating process operation are being recorded manually into a defect department logbook as a result of this process operation.

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